ATLAS-TRT Front-End Electronics
ASDBLR cards
GERBER Files
o Overview
o Tension-plate
v Stamp-card
vASDBLR card
oPS plots
oIGES files
vGerber Files
vGerber Files,
version 1
oMGC Design
oPictures
oDTMROC card
oASTRAL card
o Roof Board
o Chip Development
o Prototype boards
o Software
o Glossary and Index
 
 
o Links
Contents:
BOND1.POS Bonding of top-side chip, positive plot
BOND2.POS Bonding of bottom-side chip, positive plot
LAYER1.POS Electronics side, signal-traces, positive plot
LAYER2.POS First inner-layer, signal-traces, positive plot
LAYER3.NEG Second inner-layer, Ground power-plane, negative plot
LAYER4.NEG Third inner-layer, Supplies power-plane, negative plot
LAYER5.POS Fourth inner-layer,signal-traces, positive plot
LAYER6.POS Solder side, signal-traces, positive plot
DRILL1-6.PLT Drill holes, through plated
DRILL1-2.PLT Drill holes, top layers (blind)
DRILL4-6.PLT Drill holes, three bottom layers (blind)
DRILL5-6.PLT Drill holes, three bottom layers (blind)
DRILL.TBL Drill definition file, excellon format
APERTURE.TBL Photoplotter definition file according to PERFAG10A, gerber format
ATLAS
©1998 Particle Physics Department, Lund University
Comments to: Lund Electronics group, bjorn@quark.lu.se