||Amplifier Shaper Discriminator, Baseline restorer
||The future chips which will combine the functions of both the current ASDBLR and DTMROC.
||Chip-On-Board. The technique for bonding chip-dies directly on a PCB.
Also known as MCM-L (Multi Chip Module on Laminate).
||The PCB with bonded die(s). This PCB does the actual signal read-out.
||The integrated silicon wafer
||Radiation hardened IC process, MATRA
||Drift-time Measuring Read-Out Chip
||=dummy, a version with most or all of the mechanical properties but none or few of the electrical.
||Printed Circuit Board
||The PCB designed to cover one half of the tension-plate with mounted daughter-boards.
||Nick-name for the daughter-board with ASDBLR or DTMROC.
Based on the size which is similar to
a postage stamp.
||The PCB placed on the end of the straws. This PCB supplies the mechanical fastening for the read-out wires and
connects the input-signal to the read-out daughter-boards.
Normally abbreviated TP
||Transition Radiation Tracker, the central vertex detector for the ATLAS detector.