Printable version ATLAS Front-End Electronics
Cooling evaluation module
o Overview
o Tension-plate
o Stamp-card
o Roof Board
o Chip Development
v Prototype boards
vCooling prototype
oASDBLR simulation
oDTMROC simulation
oRoof simulation
oDTMROC tester
oHP82000 boards
oMiscellaneous test-boards
o Software
o Glossary and Index
o Links
Module description

For the full system of tension-plate with mounted electronics, we know that we will have to transport the heat generated by the read-out electronics.
As an example of the power dissipation, the inner tension-plate covers 21 DTMROCs with a power of 110mW and 42 ASDBLRs with 280mW power, or a total of almost 14W which doesn't include the power dissipated in signal drivers and receivers on the roof-board. The corresponding power for middle and outer tension-plate (Module 2&3) are 22W and 33.5W . To facilitate the measurement and to help evalutation of cooling, a evaluation module has been designed.
This module consists of special versions of the real read-out electronics.
The mechanical size and connector scheme is the same as for the real read-out electronics, thereby simulating the thermal properties and conduction available.
The evaluation boards also have thermal sensors placed all over their surfaces in order to give an accurate measurment of the heat and gradients. The selected temperature sensor is Dallas Semiconductors one-wire serial sensor DS1820.
Since these sensors are all connected on paralell on a single wire an almost infinite number of sensors can be read-out with just one data-line.

ASDBLR dummy card

The ASDBLR chips is expected to generate 35mW/channel, and since each ASDBLR chip is 8 channels this gives a total expected power dissipation of 280mW per chip.
In order to simplify tests and accuracy, each ASDBLR-chip has been replaced by 2 paralelled 180 W resitors, giving a total of 90W per 'ASDBLR'.
If powered by a normal 5V source, these resistors will dissipate 280mW.
The resistor pairs are placed on the same position on the stamp-card as the real ASDBLR-chip.
Each ASDBLR dummy board also has one temperature sensor placed on the top-side.

DTMROC dummy card

As with the ASDBLR dummy-card, the DTMROC chip power dissipation is simulated with three paralelled 470 W resistors which when powered by a 5V source dissipates 110mW which is the expected power of the DTMROC.
These boards also have a sensor placed on them on the top-side.

Roof-board dummy

The Roof-board dummy-version is split in two triangular halves, just as the real prototype board: One smaller triangle which plugs on top of 10 DTMROC/ASDBLR (dummy) stacks and contains 6 sensors on the bottom-side and 5 on top. One bigger triangle is similar with the smaller one except that it plugs onto 11 DTMROC/ASDBLR-stacks and that it contains 8 sensors on the bottom side and 9 sensors on the top.

Each triangle also has the following connectors:

DTMROC_Power Nominally +5V (max 0.5A)
ASDBLR_Power Nominally +5V (max 2A)
VCC +5V power for sensors (max 0.1A)

DTMROC_Power Sense output
  may also be used for power input
ASDBLR_Power Sense output
  may also be used for power input
VCC +5V power for sensors (max 0.1A)
Temp_Sensors Data output for all DS1820 sensors
GND Signal&power ground
Note however that since this is the only ground connection,
the total current through this pin should not exceed 1.75A.

There is also additionally 1 2x8pin MCM connector for each DTMROC connector which connects to the real DTMROC-card's slow-control and data-out lines, just in case a real DTMROC-card or DTMROC/ASDBLR-stack(s) needs to be tested in the cooling-prototype.

The schematics and physical plots can be viewed under the different headings on the left.
The controlling software can be found under software/cooling prototype.
©1998 Particle Physics Department, Lund University
Comments to: Lund Electronics group,