ATLAS Front-End Electronics
Tension-plates
o Overview
v Tension-plate
oInner Tension-plate
oMiddle Tension-plate
oOuter Tension-plate
o Stamp-card
o Roof Board
o Chip Development
o Prototype boards
o Software
o Glossary and Index
 
 
o Links
A review of the tension-plate will take place at CERN on December 2nd 1999.

The following files are the documentation for the designs.

tp-review.pdf Documentation including description of manufacturing procedure. Original, version 1
tp-review.doc Same as above, source document in MS-WORD.
tp-review2.pdf Documentation including description of manufacturing procedure. Updated, version 2
tp-review2.doc Same as above, source document in MS-WORD.
tp-tender.pdf Information on prices for manufacturing and components.
tp-tender.txt Information on prices for manufacturing and components. Pure text!
tp-qa.txt Q&A for tension-plates.
Plots
tp1-ca3.ps Tension-plate #1, final version
tp2-ca3.ps Tension-plate #2, final version
tp3-ca3.ps Tension-plate #3, final version, group/crosstalk optimized
tp3hv-ca3.ps Tension-plate #3, final version, group optimized
tp3nohv-ca3.ps Tension-plate #3, final version, crosstalk optimized
tp1-121.ps Tension-plate #1, final version, component placement, scale 1:1
tp1-noprot.ps Tension-plate #1, final version layout without protection resistors. A4
tp1-nohvprot.ps Same but no HV-grouping either! Preliminary layout. A4
tp2-121.ps Tension-plate #2, final version, component placement, scale 1:1
tp3-121.ps Tension-plate #3, final version, component placement, scale 1:1
 
NOTE: Unless specified otherwise, all of the above postscript-files are A3-size and '*-ca3.ps' are color as well
ATLAS
©1999 Particle Physics Department, Lund University
Comments to: Lund Electronics group, bjorn@quark.lu.se