Date: 20150826
Pictures taken with the microscope.
By: Ulf

Pictures 129-141
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Chip2
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this chip has been used as a working reference chip during tests
Cover glass is on, did not want to risk anything.

pad refers to pad number on silicon.

Pictures:
129 : pad 168-229 Analog input side (PCA)
130 : pad 1-48
131 : pad 49-117 (IO)
132 : pad 118-167
133 : enlargement of 129 pad 168->
134 : enlargement of 129 pad ->229
135 : enlargement of 130 pad 1->
136 : enlargement of 130 pad ->48
137 : enlargement of 131 pad 49->
138 : enlargement of 131 pad ->117
139 : enlargement of 132 pad 118->
140 : enlargement of 132 pad ->167
141 : overview of chip, pad 1 lower right corner


Pictures 142-143
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Chip 1
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perhaps tested long time ago?

Removed cover glass, for two overview pictures

Pictures:
142: Overview - pad 1 top left corner
143: Overview - pad 1 lower right corner


Bonding document
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SALTRO16_Bonding_Document_PGA180.pdf

Correspondance between package pin number and silicoon pad number.